アルミナセラミックスの無電解めっき皮膜によるメタライゼーション

Abstract

The adhesion strength between alumina ceramics and electroless Ni-P or Cu films was investigated in order to analyze the mechanism of adhesion between plated films and ceramics.The glassy parts, such as SiO2 located at the intergranular region in ceramics were selectively and effectively etched by HF solution. There is no clear relation between the mechanical properties of the metallized films and their adhesion strength, The etching amount greatly affected the adhesion strength, especially for the initial stage of etching, but the adhesion strength of the Ni-P film was always higher than that of the Cu film.The factors D/D0 and R/R0 were proposed as indicating the deposition condition at the interface between the plated films and ceramics, where D, D0 are the amounts of deposition at the substrate with and without etching, and R, R0 are film resistance on substrate with and without etching, It was confirmed that factors D/D0 and R/R0, effectively indicate the conditions of throwing power into minute etching pore at the initial deposition stage. From the values of D/D0 and R/R0, it was concluded that plated Ni-P film is deposited more effectively, and create a better anchor effect than plated Cu film.