Abstract
They have developed a non-contact, high-speed, and multipurpose solder-joint inspection method using an electro-optic (EO) probe for fine-pitch LSI-packages on printed wiring boards. The EO probe was used to detect the electric field intensity above two adjoining leads of a LSI-package with no damage. They also developed a solenoid-actuator probe that could supply alternating voltages to the lead-pad on the board at high-speed motion. By scanning the two probes mechanically at a constant velocity and by actuating the solenoid-actuator at a constant frequency above each side of the LSI-package, they could achieve a high-speed inspection. And by applying this method to a QFP package that has a 0.5-mm pitch, they succeeded in locating the open and short failures at a scanning speed of 50-pin-per-second.
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