Abstract
The amount of halogenated dioxins in combustion gases of printed circuit boards depends on the concentration of halogen in the substrate, and also changes with resin structures to be applied. In this study, it was revealed that by combined use of fine aluminum hydroxide, phosphate flame retardant and alicyclic epoxy resin instead of halogenated epoxy resin or aromatic epoxy resin, these printed circuit boards met UL94-V0 flammability classification. Furthermore halogenated dibenzodioxin/dibenzofuran was hardly detected in combustion gases. The printed circuit boards which consisted of alicyclic epoxy resin could control generating of halogenated dioxins, as compared with aromatic resin. According to the heat decomposition behavior, it was suggested that alicyclic resin was easy to decompose because of weak C-C bond strength and generating of halogenated dioxins were controlled by the structure of resins.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
