Abstract
A film formation technology using the dispersed ultra fine particle paste will be introduced. The particles under 100 am in diameter are defined as ultra fine particles (UFPs) . The melting temperatures of UFPs are extensively lower than the bulk materials, thus the dispersed UFP paste can be sintered at lower than 300°C. A film formed using the dispersed UFP paste is dense and has smooth surface because each particle is individually separated and suspend in an organic solvent without aggregations. The particles have high purity because formed in a pure inert gas atmosphere by the gas evaporation method. Several metal additives have been added to this dispersed UFP paste for improve the adhesion strength against several kinds of substrate such as glass, alumina or polyimide films. The viscosity can be controlled from 85 to 20000 cps. The direct drawing system by a micro-dispenser using this viscosity controlled paste had been developed. It can draw a line down to 40μm in width and a spot down to 30μm in diameter.
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