Abstract

This paper is concerned with the SGEMP photon direct drive response sensitivity of multi-conductor bundles of wires with a single common dielectrically bonded foil overshield. We will report the results of calculations performed using the CHIC computer code on this particular type of multi-conductor bundle. Due to the very large parameter space associated with such a wire configuration, we will also discuss how the number of variables can be effectively reduced. Such a reduction in parameter space greatly simplifies the assessment of multi-conductor bundles of wires.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.