Multi-technology simulation with mixed design environments

Abstract

Typical circuit simulation flows within a design environment provided by electronic design automation (EDA) vendors only support a single foundry process technology node. But multi-chip modules (MCM) and 3D-IC designs are typically done with multiple foundry process nodes, which bring a challenge for the EDA industry on how to simulate multiple dies with different technology nodes to capture interaction effects among various dies. Although some EDA vendors have recently introduced a Multi-Technology Simulation (MTS) feature within their design tools, it is not easy for designers to use and also does not work in cross platform design environments. In this paper, we will present an internally developed MTS methodology and utility that can work with both Cadence and Keysight ADS simulation environments based on our Central Chip Repository methodology. The paper will also describe in detail the challenges of multi-technology simulation and how to address these challenges.