Multiscale design and digital light processing preparation of high-strength SiOC ceramic metastructures for tuning microwave absorption properties

Abstract

Silicon oxycarbide (SiOC) ceramics have been used to fabricate microwave-absorbing metastructures, demonstrating impressive absorption capabilities. However, SiOC ceramic metastructures with excellent performance require simple fabrication processes and appropriate mechanical and electromagnetic properties. In this study, a solvent-free photosensitive polysiloxane preceramic was developed by blending methoxy/hydroxy polysiloxanes with acrylates, with a ceramic yield of over 60% after curing using a novel two-step ultraviolet (UV)/thermal method. The composition and microstructure of SiOC ceramics can be designed by controlling the preceramic composition. Dense, crack-free gyroid-shellular shaped triple periodic minimal surface (GS-TPMS) electromagnetic metastructures were fabricated using digital light processing (DLP) 3D printing technology. By designing the porosity of the GS-TPMS structure to 51%, an effective absorption bandwidth that covers the X-band can be achieved at a thickness of 3.1 mm. The honeycomb structure, with a geometric density of 0.69 g/cm3, exhibited a high compressive strength of 107.05 MPa. This paper presents an efficient approach for the prompt and customized fabrication of lightweight ceramic metastructures with outstanding microwave absorption properties.