Abstract
The nanocutting has been paid great attention in ultra-precision machining and high sealing mechanical devices due to its nanometer level machining accuracy and surface quality. However, the conventional methods applicable to reproduce the cutting process numerically such as finite element (FE) and molecular dynamics (MD) are challenging to unveil the cutting machining mechanism of the nanocutting due to the limitation of the simulation scale and computational cost. Here a modified quasi-continuous method (QC) is employed to analyze the dynamic nanocutting behavior (below 10 nm) of the copper sample. After preliminary validation of the effectiveness via the wave propagation on the copper ribbon, we have assessed the effects of cutting tool parameters and back-engagement on the cutting force, stress distribution and surface metamorphic layer depth during the nanocutting process of the copper sample. The cutting force and depth of the surface metamorphic layer is susceptible to the back-engagement, and well tolerant to the cutting tool parameters such as the tool rank angle and tool rounded edge diameter. The results obtained by the QC method are comparable to those from the MD method, which indicate the effectiveness and applicability of the modified QC method in the nanocutting process. Overall, our work provides an applicable and efficient strategy to investigate the nanocutting machining mechanism of the large-scale workpiece and shed light on its applications in the super-precision and high surface quality devices.
Highlights
With the rapid development of ultra-precision machining technology in recent decades, the nanocutting that offers nanometer level machining accuracy and surface quality has been an optimal approach to fulfill the fabrication of the micro/nanostructures such as the precision optical devices and high sealing mechanical devices [1,2,3]
Tothen better understand cutting process and machining during nanocutting investigated thethe effects of the back-engagement, toolmechanism rank angle and tool the nanocutting process, we investigated effects of the back-engagement, tool rank angle and rounded edge diameter onthen the cutting force,the stress distribution and depth of surface metamorphic tool rounded edge diameter on the cutting force, stress distribution and depth of surface layer by the modified quasi-continuous method (QC) method, respectively, which were further verified by the molecular dynamics (MD) method
Metamorphic layer by the modified QC method, respectively, which were further verified by the MD
Summary
With the rapid development of ultra-precision machining technology in recent decades, the nanocutting that offers nanometer level machining accuracy and surface quality has been an optimal approach to fulfill the fabrication of the micro/nanostructures such as the precision optical devices and high sealing mechanical devices [1,2,3]. Numerical simulation methods such as the finite element and molecular dynamics might provide an alternative way to understand the internal cutting machining mechanism, especially the nanoscale interaction mechanism between the tool and workpieces during the nanocutting process. The finite element (FE) method based on continuum mechanics that ignores the interaction between the atoms and bonds of the workpiece is a conventional approach to investigate the deformation and Materials 2020, 13, 3135; doi:10.3390/ma13143135 www.mdpi.com/journal/materials. The FE method is an inappropriate choice to unveil the details during the nanocutting process
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