Multiple moving interfacial cracks between two dissimilar piezoelectric layers under electromechanical loading

Abstract

The dynamic problem of several moving cracks at the interface between two dissimilar piezoelectric materials is analyzed. The combined out-of-plane mechanical and in-plane electrical loads are applied to the layers. Fourier transforms are used to reduce the problem to a system of singular integral equations with simple Cauchy kernel. The integral equations are solved numerically by converting to a system of linear algebraic equations and by using a collocation technique. The results presented consist of the stress intensity factors and the electric displacement intensity factors. It is found that generally the field intensity factors increase with increasing crack propagation speed.