Abstract
While digital microcircuits are performing increasing numbers of independent logic functions on a single chip, the diversified requirements of the typical linear system have limited most linear circuits to one function per package. A first step toward large-scale integration of linear subsystems involves development of a basic module, which may be optimized through interconnection to perform the widely varying functions in an audio, servo or rf system. This approach is more efficient, and gives more optimized performance than interconnecting general-purpose single components on a chip. The second step requires that adjacent basic modules be interconnected, and packaged as a group.
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