Abstract
We present a model of fillet formation and cure during thermocompression bonding with a non-conductive film. Process variables in the model include the position and temperature profiles applied to the silicon die and substrate by the bonding tool. The chemorheology of the underfill is accounted for in order to track the degree of cure of the material and its impact on dynamic viscosity. Simulation predictions of how the underfill chemorheology impacts the fillet shape and level of cure advance during the processes are presented.
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