Abstract

The thermal management is an ever increasing challenge in advanced electronic devices. In this paper, simulation-based optimization is applied to improve the design of a plate-fin heat-sink in terms of operational cost and thermal performance. The proposed framework combines a conjugate heat transfer solver, a CAD engine and an adapted Sandwiching algorithm. A key feature is the use of novel immersed boundary (IB) techniques that allows for automated meshing which is perfectly suited for parametric design optimization.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call