Abstract
Signal line transition with layer transition via is inevitable in multi-layer PCB. The return current can generate voltage noise between the cavities due to the discontinuity of the return current path. Other layer transition vias passing through the cavity can pick up the voltage noise and result in problems of signal integrity. In this paper, an electromagnetic bandgap (EBG) structure is proposed for suppression of the broadband cavity noise. The impedance discontinuity between layers of interleaved EBG cell enhances the efficiency of noise suppression, and the slots embedded in the EBG cell excite multi-mode resonances for extending the bandwidth of noise suppression. The dispersion diagram is utilized to preliminarily analyze the characteristic of the proposed EBG cell, and a 5×5 cells EBG board is further analyzed for characterizing the efficiency of noise suppression. Both simulation and measurement results prove the proposed structure can effectively suppress the cavity noise under −35 dB over the frequency range from 0.56 GHz to the highest measurement frequency, 20 GHz.
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