Abstract
A multileveled tunable silicon grating array is designed and fabricated on a large-scale-integration (LSI) substrate. The grating consists of 250 single crystalline silicon ribbons of 260 nm in thickness, 400 μm in length, and 10 μm in period. The LSI substrate generates voltages to vary the heights of respective grating ribbons addressed by digital signal input. Each grating ribbon is attracted by an electrostatic force generated by 6-bit applied voltage in the range from 0 to 5 V. In the fabrication, the LSI substrate and a silicon-on-insulator wafer are bonded by the two kinds of polymers. A photosensitive polyimide polymer is used for patterning the bonding pads and also for bonding the wafers at the pressure of 0.25 MPa and the temperature of 350°C. Another epoxy polymer fills the space underneath the grating ribbons for subsequent process, which is finally removed by sacrificial etching to make the grating ribbons freestanding. The tunability of the grating is examined experimentally under the basic operation conditions.
Highlights
Diffraction grating is an important optical component in spectroscopic optical systems
The static displacement and the deflection of grating ribbons were measured under the microscopic objective of the interferometer (MSA-500, Polytec) by increasing the voltage applied to a grating ribbon
The multileveled tunable silicon grating on the LSI substrate was designed and fabricated by the two-step polymer bonding method at the temperature of 350°C
Summary
Diffraction grating is an important optical component in spectroscopic optical systems. The integration of large-scale-integration (LSI) circuit with micromirrors is useful for a large scale addressable micromirror array to generate a phase-distribution of reflection grating. Suzuki et al.: Multileveled tunable silicon grating array bonded on large scale integration. A multileveled tunable silicon grating array is designed and fabricated on an LSI substrate using two-step polymer bonding method. The LSI substrate and a silicon-on-insulator (SOI) wafer are bonded by the two kinds of polymers at the temperatures lower than 350°C and the pressure of 0.25 MPa. The LSI substrate generates the voltages to vary the heights of the respective grating ribbons addressed by digital signal input. The tunability of the grating is tested experimentally under the basic operation conditions
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