Abstract
Cu/NiFe multilayers with different structures were fabricated by electroplating for electromagnetic wave interference shielding in the high-frequency region. The electromagnetic wave interference shielding effectiveness of the symmetric, asymmetric, and thickness-gradient multilayer films was evaluated to optimize these structures. The thickness of the NiFe layer, which acts as an interlayer between Cu layers, is an important factor. The five-layered thin film (S9), with a thickness gradient that continues to increase toward the lower layer, shows an electromagnetic interference shielding effectiveness of − 74 dB in the wideband region, even though the total thickness of the multilayer is 1 µm. Focused ion beam, scanning electron microscopy, vector network, X-ray diffraction, four-point probe, and inductively coupled plasma–optical emission spectroscopy analyses were performed to characterize the multilayered Cu/NiFe thin films. • A Cu/NiFe multilayer was fabricated via electroplating. • The electrical conductivity and shielding effectiveness were investigated. • The electromagnetic interference shielding mechanism of the multilayer was studied.
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