Abstract
Possibilities of the sandwich multilayer technology to design microwave integrated circuits are discussed. Original designs of various passive microwave devices realized as multilayer sandwich structures are presented. Experimental results confirmed a good potential of the sandwich technology to design high-performance multilayer microwave integrated circuits.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
