Abstract
This paper presents a method for high power density manufacturing of electronic ballast for HID lamps by utilization of a novel SMT stacked converter construction method, Power Sandwich. A two-stage topology of an HID lamp electronic ballast used in a commercial benchmark is employed as a case study. In Power Sandwich technology, new double-sided SMT x-dim components that have uniform height and enhanced thermal properties are stacked between planar substrates to achieve size reduction and better thermal performance of HID lamp ballast. A Power Sandwich prototype of a 150W HID lamp electronic ballast is developed, which has an electrical performance comparable to the commercially available benchmark counterpart but twice as high power density and better thermal performance.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
