Abstract
Nickel (Ni)/ Copper (Cu) multilayer were deposited on Cu substrate by electroplating process using dual bath technique. Individual sample of multilayer with sublayer thicknesses of 1 μm, 5 μm, 10 μm and 50 μm have been produced. The structure of the multilayer was characterized by X-Ray Diffraction and Scanning Electron Microscopy whereas one of the mechanical properties of the samples was investigated by means of Vickers Hardness. The results showed that the surface hardness of the coated Cu substrate increases if compared to that of pure Cu substrate. Additionally, these values increased when sublayer thickness of samples were decreased.
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