Abstract
not occur. The effect of E-beam exposure on multilayer processing and some of the critical chemical, mechanical, and electrical properties in this polymer are reported here. This proof-of-concept study demonstrates that polymer backbones which are not easily thermally cured (e.g., cross-linked) may be considered for interconnection dielectric materials. The polymer backbone consists of 10 mol % triethoxy silyl norbornene and 90 mol % butyl norbornene units. The chemical structures of the monomer units are shown in Fig. 1. These two monomer units are randomly copolymerized and dissolved in mesitylene to obtain a polymer solution.2 The polymer sample used in this study has a polydispersity index (M w /M n ) of 2.8 and a weight average molecular weight (M w ) of 283,000. E-beam curing was conducted
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