Multifunctional structures for advanced spacecraft

Abstract

Lockheed Martin Astronautics (LMA) is involved in the development of enabling technologies for ad- vanced spacecraft. One of the key elements of these efforts is the application of multifunctional structures (MFS) designs. The MFS design system incorporates electronics, thermal control, and structure design into a single spacecraft structural element. The electrical interconnect system is based on flexible circuit patches and jumpers that eliminate the need for black- boxes 'and cable harnesses. The system is ideally suited for high-density electronics such as multichip modules (MCM) and micro electromechanical sys- tems devices. Novel thermal techniques are incor- porated into the structure to handle the localized high heatloads. The MFS design has been included as a technology demonstration in a variety of NASA/Air Force missions such as New Millennium Program (NMP) Deep Space 1 (DSl), NMP Deep Space 2 (DS2), Space Technology Research Vehicle (STRV)- Id, MightySat II Sindri, and Advanced Technology Demonstration Spacecraft (ATDS). During the DSl mission, the MFS flight experiment has successfully performed electrical-interconnect continuity tests and measurements of thermal performance consistent with the predicted performance.