Abstract
Polymer/ceramic composites have been of great interest as embedded capacitor materials, mainly due to high dielectric constant of ceramic powders and good process compatibility of polymers with printed circuit boards (PCBs). However, one of the potential problems of polymer/ceramic composite is temperature dependence of dielectric properties. In this study, we have mainly focused on reducing temperature coefficient of capacitance (TCC) of epoxy/ceramic composite using multi-functional epoxy and SrTiO3 powder. Epoxy/SrTiO3 composite embedded capacitor films (Epoxy/SrTiO3 ECFs) using multi-functional epoxy were newly formulated. New multi-functional epoxy/SrTiO3 ECFs showed lower TCC than epoxy/BaTiO3 ECFs. Reduced TCC of epoxy/ceramic composite by using a multi-functional epoxy and SrTiO3 powder was successfully demonstrated for embedded capacitor films
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