Multidimensional cross-linked network strategies for Rapidly, Reconfigurable, refoldable shape memory polymer

Abstract

Achieving high thermal conductivity in rigid liquid crystal-based units without compromising their superflexibility is challenging. A strategy tacking synergistic enhancement of hydrogen bonds and liquid crystal main chains to form a multidimensional cross-linking network structure is proposed. An intrinsically thermally conductive shape memory polymers with ultra-high strength, ultra-high toughness, low-temperature resistance and wear resistance were obtained. It can lift up to 10,000 times its own weight (10 kg), has a bending radius of even 0.99 mm and remains super-flexible at −190 °C, achieving an unprecedented damage tolerance for thermosetting resins and laying the foundation for its foldability. We regulate the spherical crystal size by the solvent-induced self-assembly method, achieving an intrinsic thermal conductivity of 1.2 W/m·K. We took inspiration from the bionic structure of earwig wings combined with a crease vanishing function to apply high-aspect-ratio deployment structures in aerospace, achieving compatibility between deformation and load bearing.