Abstract
Among the most challenging problems of the Multi-Chip Module (MCM) technology are achieving acceptable MCM assembly yields and meeting product qualify requirements. Both of these problems can be significantly reduced by adopting adequate testing approaches, which guarantee the quality of incoming bare (unpackaged) dies prior to module assembly, ensure the structural integrity and performance of the assembled MCMs, and help isolating defective parts prior to the repair process. This paper presents a structured testability approach that helps resolving the above problems. This approach can be adopted during MCM design and utilized during the manufacturing process.
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