Year-end Sale % OFF 
Abstract
The design and implementation of package-level electromagnetic-bandgap (EBG) structures is presented. By using spiral-based inductance-enhanced electromagnetic-bandgap structures (IE-EBGs), the relative periodicity for achieving bandgap at extremely low frequencies is substantially reduced in comparison to traditional EBGs. Using both full-wave electromagnetic simulation and experimental characterization, it is demonstrated that this type of structure can exhibit multiple bandgaps, which are individually tunable through variation of the inductance per unit area and/or the unit cell periodicity. Sample structures with dimensions compatible with today's microprocessor packaging technology are designed and fabricated in a multilayer organic flip-chip ball-grid array package substrate. These package-embedded IE-EBGs have unit cell dimensions less than 750 mum and exhibit the first forbidden bandgaps for electromagnetic wave propagation below 10 GHz, which is a frequency band of interest for commercial wireless communication systems.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Microwave Theory and Techniques
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
