Multi-SWD Plasma Jet System for PECVD Deposition of Thin Films

Abstract

Multiplasma jet surface-wave discharge launched by the surfatron is a promising PECVD tool for scalable deposition of various semiconductor materials. The time-resolved Langmuir probe study revealed that the plasma plume is inhomogeneous toward the substrate. In the measured interval, the electron energy and the plasma density increased with distance from the nozzle outlet. These findings allowed us to optimize the substrate position during the deposition process.