Abstract
In the context of Industry 4.0, many production scenarios utilise sensors to monitor manufacturing processes, resulting in massive data that can be leveraged to build machine-learning models to improve production efficiency and quality. In semiconductor manufacturing, where many sensors are employed to monitor the production process, the resulting multi-sensor data poses challenges for constructing a virtual metrology (VM) model to assess wafer quality. Furthermore, building separate prediction models for each sensor can result in a loss of redundancy present in the multi-sensor data. Therefore, this paper proposes a multi-source AdaBoost with a cross-weight sampling method for predicting the critical dimension required in VM. Compared with the existing AdaBoost algorithm in regression, the proposed method adapts well to multi-source data by incorporating a cross-weight sampling distribution. Thus, when updating the sampling weight distribution, the impact of both individual and multi-source data is considered to re-sample high-quality observations. Based on the numerical results from the synthetic datasets and case study in semiconductor manufacturing, the proposed method outperforms benchmark methods. Additionally, owing to the redundancy of multi-sensor data, the proposed method demonstrates robust performance regardless of the noise level in the semiconductor VM data.
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