Abstract
The dynamic behavior of nano-void in metal Al under shock loading is simulated by using the multi-scale numerical simulation method. This method couples the molecular dynamics method used in local defect domain and the finite element method overall domain. The macroscopic failure of material is analyzed based on the microscopic dynamic behavior of nano-void. Our results show that the collapse of nano-void depends on the shock strength. Both a high and a low stress region are formed in the region of void after void collapse, whereas only a low stress region is formed under no collapse. The local hot spot is displayed in the temperature field, and a detailed analysis reveals that the hot point initiation is caused by recompression of atoms in void.
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