Multi resonance patch antenna with multiple slits

Merjem Begovic,Şehabeddin Taha İmeci

doi:10.37868/sei.v2i2.116

Abstract

In this paper, we have presented a new design of a multi resonance patch antenna with multiple slits. Slits are located on the three sides of the designed antenna. It is simulated in a planar 3D electromagnetic simulation program, called Sonnet Software, designed on the Aluminum (96%) substrate and operates at three frequencies with reflection coefficient (S11) values lower than -10 dB. Values for the operating frequencies are 4.14, 5.52, 9.24 GHz. Electric field theta polarized gains for these three frequencies are; 8.09, 8.35, and 8.39 dBs respectively. Cross polarization levels are well below -10 dB. A parametric study was conducted by changing the gap size and the dielectric thickness. As a result of the parametric study, it is seen that fabrication tolerances of the antenna are good enough.

Highlights

Rapid growth in mobile communication systems requires use of low profile, light weight, simple design and low-cost antennas in order to get efficient results
Low gain microstrip antenna is consisted of conducting patch and ground separated by dielectric substrate
Design methodology Multi slit patch antenna designs have been proposed in many literatures, and most used designs were offering E, U- and V-shaped designs of mentioned antennas [10] [11] [12]

Summary

Introduction

Rapid growth in mobile communication systems requires use of low profile, light weight, simple design and low-cost antennas in order to get efficient results. Those systems that transmit antennas in their free space can tie-up mobility, accessibility and can have sufficient range without amplification. Microstrip patch antennas are being used for a long time due to satisfying those requirements. Still, they have disadvantages such as narrow frequency band and low gain, which could be modified and increased with many proposed methods in the literature [3]. Low gain microstrip antenna is consisted of conducting patch and ground separated by dielectric substrate

Methods

Findings

Conclusion