Abstract
Pulse management of white light to maximize the sintering efficiency of a rapid (msec) andsubstrate-protective method, intense pulsed light (IPL), was studied systematically with aprintable Cu nanoink. An excessive pulse energy that induces deleterious defectson the Cu film along with damage on a plastic substrate was dissipated intomultiple sub-pulses while maintaining a total energy budget over the thresholdlevel for successful Cu sintering. Electrical properties of the metal layers wereanalyzed in conjunction with pulse formation factors such as average energy, pulseduration, peak power and pulse number to determine their respective effects on IPLsintering. In the quantitative results, the optimized sintering conditions of coppernanoparticles with a mean diameter of 30 nm and a fixed total irradiated pulse energy of32 J cm − 2 were a pulse numberand pulse width of > 4 and < 3 msec, respectively.
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