Abstract
A thermal stress field induced by non-uniform temperature often causes crack extension. Taking advantage of this phenomenon, some glassy materials can be cleaved without leaving any micro cracks on the cleaved surface. In the present paper, a possibility of the multi-point simultaneous thermal stress cleaving is discussed for brittle substrates which are heated or cooled by a plane source. Under appropriate heating or cooling, a positive mode I thermal stress intensity factor appears at crack tips. If surface cracks were previously generated on a substrate along a checkerboard-like mesh pattern, the substrate can be divided simultaneously by a single process using cracked face cooling or back face heating. The section accuracy by back face heating is better than that by the cracked face cooling because the tensile stress is induced more uniformly by the back face heating.
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