Abstract
We propose and experimentally demonstrate a photonic routing architecture that can efficiently utilize the space of multi-plane (3D) photonic integration. A wafer with three planes of amorphous silicon waveguides was fabricated and characterized, demonstrating <3×10−4 dB loss per out-of-plane waveguide crossing, 0.05±0.02 dB per interplane coupler, and microring resonators on three planes with a quality factors up to 8.2×104. We also explore a phase velocity mapping strategy to mitigate the cross talk between co-propagating waveguides on different planes. These results expand the utility of 3D photonic integration for applications such as optical interconnects, neuromorphic computing and optical phased arrays.
Highlights
One of the most prominent advantages of photonic integration is the ease with which signals can be routed over a wide range of distances without incurring excessive power penalties, losses, or cross talk
We proposed a strategy for efficient photonic routing in 3D-integrated systems
A prototype implementation was experimentally realized with three planes of amorphous silicon waveguides
Summary
One of the most prominent advantages of photonic integration is the ease with which signals can be routed over a wide range of distances without incurring excessive power penalties, losses, or cross talk. One way to circumvent these issues is to employ an additional intermediate routing plane to allow efficient coupling between smaller gaps, while maintaining a large separation in crossing areas; this has been realized with 3.1 × 10−3 dB per crossing while co-integrating modulators and detectors on the same platform, showcasing the utility of 3D integration for high-density interconnect and transceiver applications.[15] For interconnect applications requiring a few photonic planes, the need to utilize an entire plane to augment the interplane pitch may not significantly impact the cost or complexity of the system It does not take full advantage of the surface area present in each layer, which could be used to attain even greater performance. This could be the subject of future studies to further increase waveguide integration density
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