Multi‐physics field coupling modeling and simulation to study the stress evolution during HTCLS curing process

Abstract

AbstractHybrid titanium carbon laminates (HTCLs) are a new type of fiber metal laminates, that are attracting extensive attention due to their comprehensive mechanical and physical properties. The curing stress is an important factor affecting the manufacturing performance of HTCLs. Based on viscoelastic mechanics and temperature variation characteristics of materials in this work, the multi‐physics field coupling modeling and simulation are conducted, and the stress evolution mechanism during HTCLs curing process is investigated. Furthermore, the interlayer interfacial damage of HTCLs induced by the curing stress is analyzed combined with the microscope images. Results show that the restriction of metal layers and the stacking sequence of carbon fiber prepregs are the primary reasons for generating significant stress during HTCLs curing. The secondary insulation stage of HTCLs curing process has a positive effect on suppressing the curing stress, by which the interfacial stress between the different metal layers and prepregs layers can decrease by 10.53%, 4.06%, 10.24%, and 1.11%. From the beginning of cooling to the end of curing, the residual stress in HTCLs increases rapidly, and the maximum can increase by 197%. Stress concentration is easily generated on the edges of HTCLs, and the interfaces near the bottom of HTCLs are more prone to forming cracks and delamination.Highlights A multi‐physics field coupling model for HTCLs curing process is established. The viscoelastic mechanics and the temperature variation characteristics of materials are considered in this model. The stress evolution mechanism during HTCLs curing is studied. The interface damage of HTCLs induced by the curing stress is analyzed combined with experiments.