Abstract
Photochemical machining (PCM) is one of the fastest emerging nontraditional machining processes. It is used for the fabrication of burr free, flat plate and complex parts. Taguchi method analysis technique is used for the optimization of the process parameters used for the etching of copper material. Significant process parameters such as temperature, concentration and time are considered to study their effects on response variables such as undercut and surface roughness. For this, three parameter three level values, L27 orthogonal array (full factorial) is used for detailed experimentation. Analysis of variance is performed in order to investigate the effects of input parameters on output parameters under consideration. Further, grey relational analysis (GRA) is performed in order to consider the multi- objective optimization. The range of undercut is found to be 0.025 mm to 0.065 mm and range of surface roughness is found to be 0.26 µm to 2.32 µm.
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