Abstract
A multiobjective evolutionary method is proposed for the optimization of surface mount device (SMD) multilayer ceramic chip (MLCC) capacitors used for decoupling on printed circuit boards (PCBs) with resonant power–ground plane pairs. The proposed approach provides options for designers to meet power integrity specifications by employing uniform-valued capacitors that help to reduce the bill-of-material (BOM) cost and mitigate the part procurement risk. It is also shown that uniform MLCC capacitors with variable distance from power pins can have a similar decoupling effect to an assortment of capacitors. By simultaneously optimizing the pin-capacitor distance and value, the proposed method is shown to allow for the allocation of fewer decoupling capacitors under the ball-grid-array (BGA) pin field of an integrated circuit (IC) device.
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