Multi-input and multi-output SOI (MIMO-SOI) platform for silicon photonics

Abstract

We have proposed and demonstrated a method for the fabrication of a SOI platform with custom-design device layer thickness ( 1 μm, operating at λ ~ 1550 nm. The input/output waveguides can be pigtailed with standard single-mode fiber with lensed tip ensuring modal overlap of >70% (coupling loss <1.5 dB). Such a multi-input multi-output SOI platform will facilitate for CMOS silicon photonics based on-chip applications with an additional usage freedom of device layer thickness. Moreover, it can be potentially used to design SOI based stand-alone devices which can be useful at transmitters/repeaters for short-haul/long-haul optical communication.