Abstract
MULTI-CHIP COUPLING THERMAL RESISTANCE TOPOLOGICAL NETWORK MODEL AND CHIP JUNCTION TEMPERATURE PREDICTION OF SYSTEM IN PACKAGE
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https://doi.org/10.1615/heattransres.2022044334
Copy DOIJournal: Heat Transfer Research | Publication Date: Jan 1, 2023 |
MULTI-CHIP COUPLING THERMAL RESISTANCE TOPOLOGICAL NETWORK MODEL AND CHIP JUNCTION TEMPERATURE PREDICTION OF SYSTEM IN PACKAGE
Join us for a 30 min session where you can share your feedback and ask us any queries you have