Abstract
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4-phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1. In order to modify the dielectric constant (Dk), coefficient of thermal expansion (CTE) and other performances of laminates, Li2TiO3 (LT) ceramic powders were introduced into the resin matrix. The composite laminates showed low dielectric loss of 0.0026 at 10 GHz and relatively high flexural strength of 125 MPa when the mass ratio of LT fillers to resin is 0.4. Moreover, the composite laminates all maintain low water uptake (<0.5%). The microstructure and thermal properties of composite laminates filled with LT ceramic powders were also tested. These results show that copper clad laminates prepared with modified polyphenylene ether (MPPE)/SEBS and LT ceramic fillers have strong competitiveness to fabricate printed circuit boards (PCBs) for high-frequency and high-speed applications.
Highlights
With the rapid development of electronic technology and the advent of the 5G era, unprecedented opportunities have been brought to the research and development of high-performance printed circuit boards (PCBs) worldwide
The copper clad laminates (CCLs) consist of insulation layer and copper foils, and the performances of CCLs are mainly determined by the insulation layer
The obtained CCLs maintain low Dk (3.6) as well as low dissipation factor (Df) (0.0026) at high frequency and show relatively high flexural strengths (125 MPa) without adding crosslinking agents.2020, These results indicate that CCLs with modified polyphenylene ether (MPPE)/SEBS and LT ceramic have great application
Summary
With the rapid development of electronic technology and the advent of the 5G era, unprecedented opportunities have been brought to the research and development of high-performance printed circuit boards (PCBs) worldwide. High-frequency and high-speed PCBs are needed in the fields of microwave components, automotive electronics, satellite broadcasting and communication, radar and other high-frequency communications devices. As the important raw material of PCBs, copper clad laminates (CCLs) serve as a basic structural foundation and connect the loaded electronic components. Since the high-performance PCBs transfer information in high frequency and high speed, CCLs with low dissipation factor (Df) are getting increasing attentions and researches. The insulation layer of CCLs is polymeric composite, which is made of polymer resins, ceramic powders, and glass fabrics. The polymeric composites with a low dissipation factor (Df) is ideal for application in high-frequency copper clad laminates
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