Abstract
AbstractGraphene oxide (GO) and silver (Ag) nanoparticles were incorporated into the structurally stable microporous copper architecture by electro‐co‐deposition and galvanic displacement reaction to enhance the thermophysical properties. The microporous architecture of copper (Cu) was prepared by carrying out one‐step electrodeposition over a plain copper substrate. The microporous copper deposit laden with micropores and nanodendrites contributes to a substantial surface area. The structural stability of the copper architecture prepared by one step was fortified by carrying out two steps. The two‐step electrodeposited copper decorated by Ag dendrites displayed hydrophobicity as Ag dendrites screened the pores, limiting the interaction of water. The presence of GO sheets hampered the concentration of Ag dendrites due to the blanketed copper grains and modified the wettability from permanent hydrophobicity to hydrophilicity.
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