Abstract
The interfacial properties of metal contacts on organic substrates are strongly determined by the preparation conditions of the gold film. A gold–diindenoperylene (DIP) interface has been studied as a model system for metal contacts on organic electronic devices. The Figure juxtaposes the two deposition methods used, whereby only the first method leads to a well-defined interface with only a slight amount of diffusion of the gold film into the DIP layer.
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