Abstract
In order to clarify the effect of the addition of Co to the Sn-Ag solder, the formation and growth of an intermetallic compound (IMC) at the interface between Sn-Ag(-Co) solders and a Cu pad were investigated, and the joint strength of the solder with a Cu pad was also evaluated by a bump pull test. Binary Sn-3.5mass%Ag solder was used as the basic solder, and Sn-3.5mass%Ag-xCo solders (x = 0.1 mass%, 0.3 mass%, and 0.5 mass%) were specially prepared as Co-added solders. For the reflow process, specimens were heated in a radiation furnace at 523 K for 60 s. For the aging process, some specimens were then heat-treated in an oil bath at 423 K for 168 h, 504 h, and 1008 h. The results show that the addition of Co to the Sn-Ag solder strongly affected the formation and growth of the IMC at the interface. The results of the pull test clearly show that all solders had similar pull strengths, regardless of the Co addition, although the IMC morphology at the interface of the Sn-Ag-Co solder was quite different from that of the binary Sn-3.5Ag solder.
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