Abstract
In recent years, the increasing use of shape memory alloy (SMA) actuators, in the form of wire for advanced composite structures, enhances an urgent need for the development of a reliable and secure bonding technique for ensuring a full stress transfer from actuators to composite structures. A new configuration of SMA wire, which is able to increase the bonding strength between the wire and matrix in the composite, is introduced. NiTi wires were twisted to certain numbers of turn in order to increase the wire's surface roughness before embedding into epoxy matrix cylinders. Wire pullout tests were performed to study the bonding strength of a NiTi/epoxy interface. The experimental results and SEM observations indicated that the overall bonding strength and cracks on the Ti 2NiO x film of the wires increased with increasing the numbers of turn of the embedded wires. These cracks can increase the surface roughness and, thus, increase the maximum pullout strength of smart composite systems. However, the maximum strain recovery limit of twisted wire is restricted to a total number of 15 turns, further increasing the numbers of turn results in increasing the unrecoverable strain of the wire.
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