Abstract
A novel process for monolithic integration of RF microelectromechanical system (MEMS) switches with three-dimensional antenna elements on a microwave laminate printed circuit board (PCB) is presented. This process calls for a low-temperature (90/spl deg/C-170/spl deg/C) high-density inductively coupled plasma chemical vapor deposition technique that allows the choice of any PCB substrate, such as RO4003-FR4 (/spl epsiv//sub r/=3.38, tan/spl delta/=0.002), with the desired electrical properties for antenna applications. A two-element diversity antenna system monolithically integrated with RF MEMS switches is designed and demonstrated.
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