Abstract

In this letter, we demonstrate a GaN-based E/D-mode (Enhancement/Depletion-mode) inverter with PEALD-AlN (Plasma Enhanced Atomic Layer Deposition) and LPCVD-SiN (Low Pressure Chemical Vapor Deposition) as bilayer gate dielectric, where the E-mode GaN-MISHEMT is fabricated based on our proposed self-terminating gate recess etching technique. The combination of the two dielectrics makes the device exhibits high gate swing and low dielectric/III-V interface state densities. So that the fabricated inverter shows a large logic swing, high temperature stability and low hysteresis effect.

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