Abstract
This paper outlines the technique and applications of using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) to monitor the degree of cure of process-cured epoxy adhesives with poor adhesion strength. Thermal events, such as residual cure and glass transition, detected by DSC analysis can be used to monitor insufficiently-cured thermal-curing adhesives. Both heat of residual cure and glass transition is directly proportional to the degree of cure or conversion from unreacted to reacted. Glass transition also governs the maximum operating temperature of the sub-assembly. The absence of residual cure of improperly-cured photo-curing epoxy adhesives during further exposure to heat makes it difficult to monitor these grade of adhesives by DSC. The weight loss profile of selected photo-curing adhesives by TGA can be used to qualify a photo-curing adhesive.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
