Abstract
Cracks will inevitably occur in concrete structures or members during the construction process and service life due to aging, environmental factors, external loads, etc. To improve the strength and stability of the cracked concrete structures, many methods have been proposed to repair the cracks. However, the monitoring of the repairing process and repair quality has not been fully studied. The previous studies have proved that the spherical smart aggregates (SSAs) based on the electromechanical impedance (EMI) technique have outperformed the traditional smart aggregates (SAs) based on the EMI technique in structural health monitoring of civil structures, however, SSAs have not been applied to the monitoring of the concrete crack repair. In this work, the monitoring of the concrete crack repair using the SSAs based on the EMI technique was explored. A total of eight concrete specimens were prepared, and cracks in the concrete specimens were simulated by manually cutting under laboratory conditions. According to the principle of grouting method, two repair agents including cement paste and cement mortar were used to repair the cracks. The impedance signals of 28 d were measured, and three quantitative indicators, namely root mean square deviation, mean absolute percentage deviation, and correlation coefficient deviation were used to evaluate the quality of the concrete repair effect. The results indicate that the SSAs show excellent sensitivity and stability over the traditional SAs. In addition, the normalized values of the quantitative indicators were analyzed to distinguish the types of repair agents. A mathematical expression of exponential function was also proposed by fitting the experimental data to quantitatively evaluate and predict the repair effect of concrete cracks. Further, the influences of temperature, humidity, crack depth and width on the experimental results were analyzed and discussed. The numerical simulation was also presented to validate the reasonability of the experimental results.
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