Monitoring cell adhesion by using thickness shear mode acoustic wave sensors

Abstract

The thickness shear mode (TSM) acoustic wave sensor attached with living cells has been shown to be an effective functional biosensing device to monitor the process of cell adhesion to a surface in real time. In this study, a multilayer sensor model that includes a quartz substrate, a cell–substrate interfacial layer and a cell layer was constructed based on the state of cell adhesion to the substrate. The dynamic process of cell adhesions as a function of cell seeding densities was monitored using the acoustic wave sensor. The mechanisms that are responsible for the frequency and resistance change are discussed according to the predictions of the acoustic wave sensor model. In addition, knowing that the actin cytoskeleton is important for cell adhesion, we investigated the motional resistance change caused by the disruption of actin cytoskeleton induced by fungal toxin cytochalasin D in the human skin fibroblasts. The results indicate that resistance changes are related to the disruption of actin cytoskeleton and dosage-dependent.