Abstract
The thermal stability of MoSix Schottky contacts to GaAs has been studied. The contacts were analysed by Rutherford backscattering spectroscopy (RBS), X-ray diffraction (XRD), sheet resistance, and current-voltage measurements. We have studied MoSix with the compositionsx=0, 0.3, 0.6, 1, and 2. The films were annealed at various temperatures up to 850°C. The thermal stability of the films is found to bex-dependent. The best composition for thermally stable Schottky contacts is Mo5Si3. Good Schottky characteristics were retained with annealing temperatures up to 850°C for 30 min.
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