Molecular plating of actinide compounds on wafer-scale aluminum substrate

Abstract

A homogeneous thin film of actinide oxides on a metal substrate is very important for nuclear analysis. Compared with physical deposition methods, molecular plating attracts considerable attention because of its wide applicability, high utilization rate, and low consumption of actinide compounds. Distinct from conventional electroplating, molecular plating is generally performed in an organic solvent without additional supporting electrolyte except for dissolved actinide compounds. The potential distribution and the mass transfer processes are crucial for achieving high purity and uniform thickness. Because actinides are rare resources, it is essential to set up a theoretical model to ensure the controllable fabrication of actinide targets. For these, we design a profiled rotating electrode made using platinum-covered titanium wire (Pt-Ti) as the anode, and we simulate the potential and current distribution between the profiled Pt-Ti anode and the aluminum cathode by finite element analysis, considering factors such as the electrode shape, the rotation rate, the anode-cathode distance, etc. The theoretical model is accurate, and the wafer-scale actinide targets are fabricated with high quality and high efficiency.