Abstract

In this paper we consider modern methods of optical process monitoring and control in the context of atomic layer epitaxy. One specific method, p-polarized reflectance spectroscopy (PRS), is chosen to assess details of layer-by-layer growth. We show that PRS monitoring under conditions of steady-state growth by pulsed chemical beam epitaxy (PCBE) can achieve the deposition of molecular layers of GaP on silicon (100) deposited with a precision of 5%, which can be improved by reducing the growth rate and increasing the period of time averaging of the reflectance data. Since in the nucleation period prior to formation of a contiguous heteroepitaxial film inhomogeneous surface chemistry and roughening complicates the modeling of the overgrowth process, advances in both experimental methods and theory are required for extending the control to non-steady-state growth conditions. Results of simultaneous single-wavelength PR monitoring and laser light scattering measurements in conjunction with atomic force microscopy studies of short period heteroepitaxial overgrowth processes are presented. The extension of PRS to the monitoring of organometallic chemical vapor deposition at higher pressures is also discussed.

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