Abstract
Molecular dynamics (MD) simulation was conducted to investigate the coalescence of Cu nanoparticles and their deposition on a Cu substrate at various temperatures from 400 K to 1,000 K using the embedded atom method (EAM). The x-z plane projection, spreading index, coalescence index, and pair-correlation distribution were analyzed to gain more insight into the sintering process. Simulation results showed that even at a low temperature of 400 K, metal spheres can be collapsed and deposited on the substrate. Yet higher temperatures were helpful in enhancing the degree of collapsing and deposition.
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